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800nm High RI Oxide Pillars
Diffractive Optimal Element
SEM image of a 4-state pixelated polarizer made with NIL

800nm High RI Oxide Pillars
Polarizer Comparison Tool

Diffractive Optimal Element
Polarizer Comparison Tool

SEM image of a 4-state pixelated polarizer made with NIL
Polarizer Comparison Tool

NanoStructure Solutions™


MOXTEK has been producing nanostructured optical components for over 20 years. We offer high volume wafer replication of various nanostructure devices on Ø200mm wafers. Our versatile capabilities are used to manufacture functional nanostructure devices including: microlens arrays, waveguides, patterned metasurfaces, Diffractive Optical Elements (DOEs), photonics crystals, and biosensor arrays. These devices are used for imaging, illumination, and display systems for a variety of applications including: automotive, medical/dental imaging, camera systems, and many others.

Moxtek collaborates with customers to verify designs and create solutions for high volume manufacturing. We provide options for prompt design iterations and print optimization. Moxtek uses Statistical Process Control (SPC) monitoring of post-print CD repeatability.

Moxtek offers prototyping samples on our recurring Design Master Shuttle. This NIL Design Master Shuttle includes space for multiple (different) design structures, which allows engineers to test several designs on a single shuttle iteration thereby reducing development time/cost. We can add your unique design on our next Design Master Shuttle for prototyping your latest lens or nanostructure optical device. These design shuttles are processed multiple times a year.

Moxtek has over 25,000 ft2 of clean room space dedicated to high volume manufacturing. We offer state of the art manufacturing on Ø200mm wafers, with annual wafer volume capability of hundreds of thousands of wafers per year.
Manufacturing Capabilities
  • High Volume Manufacturing
  • Prototyping Options
  • NanoImprint Lithography (NIL)
  • Design Master Shuttle
  • Master creation, Stamp making
  • Deposition (PECVD, Sputter, ALD)
  • Etching (metals, oxides low to high refractive index)
  • AFM and SEM
  • Optical metrology and inspection
Configurable Parameters
  • Minimum CD:  30nm
  • Master Aspect Ratio:  ≤ 2 (CD Height/Width)
  • Master Wafer Type:  Silicon (Preferred)
  • Master Wafer Size:  Ø300mm, Ø200mm (preferred) Ø150mm (acceptable)
  • Residual Layer Thickness:  15nm < X < 25nm
  • Substrate Detail:  Ø200mm glass/fused silica/silicon/sapphire Thickness: 0.675mm to 1.8mm
  • Resist Mask:  Oxide-based sol gel, UV curable, or nano particle resist