Design and assembly of micro-electronic hybrid packages including wirebonding, die bonding, bonding, and testing.
すべての市場が、現実世界における問題の解決に向けて、大きな一歩を踏み出すユニークなテクノロジーを求めています。それを成し遂げるには、それぞれのソリューションに革新的なコアテクノロジーが必要です。 過去25年間、Moxtekはあなたのような天才との共同研究で、アイデアを現実化する高度なコアテクノロジーを発見・開発してきました。
Design and assembly of micro-electronic hybrid packages including wirebonding, die bonding, bonding, and testing. Learn more
We have over 25,000 sq ft of cleanroom space equipped with lithographic tools, sputter tools, and etch tools, as well work areas equipped to manufacture optical assemblies. Learn more
We have over 25,000 sq ft of cleanroom space equipped with lithographic tools, sputter tools, and etch tools, as well work areas equipped to manufacture optical assemblies.
Our family of cleanrooms are versatile to accommodate the different specifications and manufacturing requirements of each project.
Do you need high voltage that meets limited space requirements? We specialize in creating power supplies that operate at voltages up to 80kV—in volumes smaller than a match box that can be powered with a battery. Learn more