Design and assembly of micro-electronic hybrid packages including wirebonding, die bonding, bonding, and testing.
每個市場都需要專屬的技術突破,才能解決現實的問題, 而每種解決方案都需要有革命性的核心技術才能完成任務。25 年來,我們和您這樣的天才合作,探索及開發出先進的核心技術,將靈感化為現實。
Design and assembly of micro-electronic hybrid packages including wirebonding, die bonding, bonding, and testing. Learn more
We have over 25,000 sq ft of cleanroom space equipped with lithographic tools, sputter tools, and etch tools, as well work areas equipped to manufacture optical assemblies. Learn more
We have over 25,000 sq ft of cleanroom space equipped with lithographic tools, sputter tools, and etch tools, as well work areas equipped to manufacture optical assemblies.
Our family of cleanrooms are versatile to accommodate the different specifications and manufacturing requirements of each project.
Do you need high voltage that meets limited space requirements? We specialize in creating power supplies that operate at voltages up to 80kV—in volumes smaller than a match box that can be powered with a battery. Learn more