Hybrid Micro-Electronic Circuits

Step 1 of 3: Contact Information
Date Product Needed
MM slash DD slash YYYY
Company*
First Name*
Last Name*
Phone*
Street Address
Email*
State / Province / Region
City
Country*
Postal Code*
Product Group*
Referred By
Other
Attach Document
Accepted file types: pdf, doc, docx, xls, xlsx, jpg, jpeg, png, gif, tiff, dwg, Max. file size: 10 MB.

Step 3 of 3: Additional Information
When do you expect to place an order?
MM slash DD slash YYYY
What is the application?
What is the target market?
What is the annual forecast?
Where will the application be manufactured?
Customer Part ID (If Applicable)
Is this product in production?
If not in production, when will it be launched?
MM slash DD slash YYYY
Attach Document Below
Accepted file types: pdf, doc, docx, xls, xlsx, jpg, jpeg, png, gif, tiff, dwg, Max. file size: 10 MB.
Mount Drawing
Max. file size: 10 MB.
Labeling, Packaging and other Special Requirements
Email
This field is for validation purposes and should be left unchanged.

Hybrid Micro-Electronic Circuits | Moxtek

Design and assembly of micro-electronic hybrid packages including wirebonding, die bonding, bonding, and testing.